- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patent holdings for IPC class H01L 25/00
Total number of patents in this class: 8752
10-year publication summary
|
743
|
856
|
907
|
929
|
874
|
943
|
869
|
902
|
820
|
299
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1961 |
| Intel Corporation | 45621 |
506 |
| Samsung Electronics Co., Ltd. | 131630 |
470 |
| Micron Technology, Inc. | 24960 |
423 |
| Murata Manufacturing Co., Ltd. | 22355 |
183 |
| International Business Machines Corporation | 60644 |
152 |
| Kioxia Corporation | 9847 |
150 |
| Yangtze Memory Technologies Co., Ltd. | 1940 |
126 |
| Invensas Corporation | 645 |
117 |
| Qualcomm Incorporated | 76576 |
108 |
| Sandisk Technologies LLC | 5684 |
104 |
| STATS ChipPAC Pte. Lte. | 1516 |
97 |
| Infineon Technologies AG | 8189 |
91 |
| Xilinx, Inc. | 4086 |
91 |
| SK Hynix Inc. | 11030 |
87 |
| Nanya Technology Corporation | 2000 |
87 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
84 |
| Texas Instruments Incorporated | 19376 |
83 |
| Monolithic 3D Inc. | 270 |
81 |
| Semiconductor Components Industries, L.L.C. | 5345 |
75 |
| Other owners | 3676 |